ML2 means the maskless lithography. It is necessary to refinement process. Described above, "double / mutiful patterning" in additional cost savings as an alternative to be appropriate. Nano devices with decreasing the size of the unilateral use light to produce a mask for the lithography process takes time and cost. Small production of nano scale patterning process is suitable, and the suitable
(4) Double patterning
The double patterning is divided into four parts, leading with wafer requirements and then two sets of lithographic requirements (Generic Pitch Splitting - Double Patterning Requirements Driven by MPU metal Half-Pitch and Generic Spacer Patterning Requirements - Driven by Flash). The lithography requirements are different for each process; the requirements for pitch splitti
○ PECVD
∙ What is PECVD?
⇒ Radio frequency(RF) is used to induce plasma in the deposition gas.
⇒ This results in a higher deposition rate at relatively low temperatures.
⇒ With the plasma enhanced CVD process is the deposition at temperature around 300℃ allows.
⇒ The temperature will be through encouragement of a plasma with high frequency electric fields triggered.
(1) no effective treatment
(2) lung transplantation
(3) smoking cessation
7) 예후
Factors influencing progression
① cumulative exposure to asbestos
② duration of exposure
③ type of asbestos exposure
3. 탄광부 진폐증 (Coal Worker's Pneumoconiosis)
1) 석탄분진을 흡입하여 발생
2) simple : opacity < 1 cm
The sensory fibers of pulp transmit only pain,
whether the pulp has been cooled or heated
no response
mild to moderate degree of awareness of slight pain that subside within 1-2 sec
strong, momentary painful response that subside within 1-2 sec
moderate to strong painful response that lingers for several sec or longer
1. Cleaning
- For elimination particle
2. Deposition
- Formation some material layer on the substrate
3. Photolithography
- Formation some pattern
4. Etching
- Elimination substrate or PR layer
Material to be evaporated is heated to
increase vapor pressure
In a reasonably high vacuum, material
atoms fly to a target and stick onto the
surface
Source materi
1. Photo Lithography
(1) 리소그래피 기술의 개요2-
(1)
리소그래피는 포토마스크 기판에 그려진 VLSI의 패턴을 웨이퍼 상에 전사하는 수단이다. 포토레지스트(감광성 수지)의 도포에서 시작되어 스테퍼(노광장치) 스테퍼(stepper) - p8 참조
에 의한 패턴의 축소투영노광, 현상을 거쳐 포토레지스트를
Lithography
Si Wafer coated with PR
Spin coating
PR is coated evenly by turning round rapidly.
Exposure
Align the Mask exactly and emit UV.(fixed 10sec)
Observation
See the completed sample through SEM
Development
∙ Dip the sample in the alkaline solution.
→(process parameter : 10sec 60sec 180sec)
∙ Due to differences in solubility of the exposed portion to be dissolv
[응급처치] 응급환자관리
I. 화상(burns)
화상은 직접적인 온열손상, 화학물에의 노출 또는 전기물체와의 접촉에 의해 일어난다.
(1) 열화상(thermal burns)
1/ 병력수집
․ 화상이 발생한지 얼마나 되었나?
․ 화상발생 후 어떤 응급처치를 시행했나?
․ 연기, 증기, 기타 산화물이 가득 찬
thermal cracking of dicyclopentadiene
FeCl2∙4H2O
Dimethyl sulfoxide
Concentrated aqueous HCl
ice
Cylinder of nitrogen
Fractional distillation apparatus
250mL three-necked (standard taper joints) round-bottom flask
Magnetic stirrer and large stirring bar
100mL dropping funnel, standard taper
T-tube mercury bubbler with standard taper connection to flask
Pyrex Petri dish with